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Will enable direct semiconductor wafer bonds for next-generation solar cells
June 4, 2013
By: DAVID SAVASTANO
Editor, Ink World Magazine
The Fraunhofer Institute for Solar Energy Systems ISE announced that it has joined forces with EV Group (EVG) to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature. The new solutions, developed in partnership with Fraunhofer ISE based on EVG’s recently announced ComBond technology, aim to enable highly mismatched material combinations like gallium arsenide (GaAs) on silicon, GaAs on indium phosphi...
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